| PART |
Description |
Maker |
| BM-20EG57MD |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BM-10EG58MD |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BD-A404ND |
hi-eff red chips, GaAsP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BD-F814RD |
hi-eff red chips, which are made from GaAsP on GaP substrate.
|
Bright LED Electronics Corp.
|
| BD-A514RE |
hi-eff red chips, which are made from GaAsP on GaP substrate
|
BRIGHT LED ELECTRONICS CORP
|
| BD-F304RD |
800mA Buck Converter for 3G RFPAs, WL-CSP-12, Tape & Reel
hi-eff red chips, which are made from GaAsP on GaP substrate.
|
Bright LED Electronics Corp.
|
| PL22-CDR12 |
8mm Hi-Eff Red LED
|
P-tec Corporation
|
| BL-HE134A-TRB |
Hi-Eff Red Suitable for all SMT assembly methods.
|
BRIGHT LED ELECTRONICS CORP
|
| BL-HE135A-TRB |
Hi-Eff Red Suitable for all SMT assembly methods.
|
Bright LED Electronics Corp.
|
| BL-BEG204-B |
Hi-Eff Red and Green Low current requirement.
|
BRIGHT LED ELECTRONICS CORP
|
| BL-BEG271 |
LED Hi-Eff Red and Green Low current requirement.
|
BRIGHT LED ELECTRONICS CORP
|
| BL-BEG274 |
LED Hi-Eff Red and Green Low current requirement.
|
BRIGHT LED ELECTRONICS CORP
|
